
16 % zniżki
3D Interconnect Architectures for Heterogeneous Technologies
Modeling and Optimization
Cena sprzedaży
483,00 zł
Zwykła cena
574,00 zł
Cena jednostkowa
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Niedostępne
Według Lennart Bamberg
Opis
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.
3D Interconnect Architectures for Heterogeneous Technologies
