• Book cover of: Advances in Embedded and Fan-Out Wafer Level Packaging Technologies. By: Steffen Kroehnert

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Steffen Kroehnert

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Leidimo metai 2019 m.
Puslapių skč. 576 psl.
Viršelis Kietas viršelis
ISBN 9781119314134

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies by Steffen Kroehnert, Beth Keser.

Published by Wiley & Sons, Incorporated, John, (2019), Hardback, 576 pages.

Topics: Integrated circuits, Electronic packaging.

Book cover of: Advances in Embedded and Fan-Out Wafer Level Packaging Technologies. By: Steffen Kroehnert

Advances in Embedded and Fan-Out Wafe...

616,00 zł
616,00 zł 635,00 zł