• Book cover of: Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set). By: Avram Bar-Cohen

Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)

Avram Bar-Cohen

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Autorius Avram Bar-Cohen
Leidimo metai 2019 m.
Puslapių skč. 1080 psl.
Viršelis Kietas viršelis
ISBN 9789811201110

Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set)

Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set) by Avram Bar-Cohen, Jeffrey C Suhling, Andrew A O Tay.

Published by World Scientific Publishing Company, (2019), Hardback, 1080 pages.

Topics: Manufactures.

Book cover of: Encyclopedia Of Packaging Materials, Processes, And Mechanics - Set 1: Die-attach And Wafer Bonding Technology (A 4-volume Set). By: Avram Bar-Cohen

Encyclopedia Of Packaging Materials, ...

6.531,00 zł
6.531,00 zł 6.733,00 zł