Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.
Introduction to Microsystem Packaging...
Cena regularna
990,00 zł
Cena sprzedaży
990,00 zł
Cena regularna
1.022,00 zł
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