• Book cover of: Supercharge, Invasion, and Mudcake Growth in Downhole Applications. By: Wilson Chin

Supercharge, Invasion, and Mudcake Growth in Downhole Applications

Wilson Chin

985,00 zł
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Autorius Wilson Chin
Leidimo metai 2021 m.
Puslapių skč. 528 psl.
Viršelis Kietas viršelis
ISBN 9781119283324

Supercharge, Invasion, and Mudcake Growth in Downhole Applications

Supercharge, Invasion, and Mudcake Growth in Downhole Applications by Wilson Chin, Tao Lu, Xiaofei Qin, Yongren Feng, Yanmin Zhou.

Published by Wiley & Sons, Limited, John, (2021), Hardback, 528 pages.

Book cover of: Supercharge, Invasion, and Mudcake Growth in Downhole Applications. By: Wilson Chin

Supercharge, Invasion, and Mudcake Gr...

985,00 zł
985,00 zł 1.016,00 zł